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期刊專利論文

2014年環氧膠美國專利目錄

來源：互聯網2016年01月11日

閱讀次數：次

2014年環氧膠美國專利目錄

PAT. NO.		Title
1	8,927,663		Epoxy resin hardener compositions and epoxy resin compositions containing such hardener compositions
2	8,927,662		Binder of reactive polyarylethersulphone and epoxy resin
3	8,921,461		Epoxy resin composition and semiconductor device
4	8,911,586		One liquid type cyanate-epoxy composite resin composition
5	8,907,137		Epoxy resin production
6	8,877,878		Epoxy resin composition with sulfonium borate complex
7	8,877,866		Curable epoxy resin compositions having improved adhesion to metal substrates and processes for making and using the same
8	8,877,837		Curing of epoxy resin compositions comprising cyclic carbonates using mixtures of amino hardeners and catalysts
9	8,867,885		Optical waveguide forming epoxy resin composition, optical waveguide forming curable film, light transmission flexible printed board, and production method for the flexible printed board
10	8,865,801		Epoxy resin-based coating composition
11	8,859,695		Activator for epoxy resin compositions
12	8,858,752		Structural epoxy resin adhesives containing elastomeric tougheners capped with ketoximes
13	8,858,358		Tubular body made of fiber-reinforced epoxy resin material
14	8,853,734		Curable epoxy resin composition
15	8,852,734		Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and semiconductor device
16	8,846,799		Epoxy resin composition, prepreg, and metal-clad laminate and multilayered printed wiring board
17	8,840,963		Environmentally friendly water-based epoxy resin composition and a use therefor
18	8,829,212		Method of separating solid salt from epoxy resin solutions
19	8,822,832		Epoxy resin composition for printed circuit board, insulating film, prepreg, and multilayer printed circuit board
20	8,815,400		Epoxy resin composition, die attach method using same, and semiconductor device containing cured product thereof
21	8,809,422		Epoxy resin curing indicator composition
22	8,802,776		Epoxy resin composition, method for producing composite unit using the epoxy resin composition, and composite unit
23	8,796,391		Epoxy resin curing compositions and epoxy resin systems including same
24	8,779,036		Catalysis of epoxy resin formulations
25	8,779,034		Epoxy resin compositions
26	8,779,032		Epoxy resin based core filler material developing low exothermic heat
27	8,778,597		Long-chain alkylene-containing curable epoxy resin composition
28	8,772,424		Curable phosphorus-containing flame retardant epoxy resin
29	8,759,457		Epoxy resin compositions having improved low temperature cure properties and processes and intermediates for making the same
30	8,758,549		One component epoxy resin composition
31	8,748,513		Epoxy resin composition, and prepreg and printed circuit board using the same
32	8,748,085		Use of photosensitized Epon epoxy resin 1002F for MEMS and bioMEMS applications
33	8,747,605		One-part structural epoxy resin adhesives containing elastomeric tougheners capped with phenols and hydroxy-terminated acrylates or hydroxy-terminated methacrylates
34	8,742,055		Production of epoxy resins using improved ion exchange resin catalysts
35	8,741,988		Use of cyclic carbonates in epoxy resin compositions
36	8,729,715		Epoxy resin composition for semiconductor encapsulation
37	8,729,192		Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol resin and semiconductor-encapsulating material
38	8,710,122		Halogen-free flame retardants for epoxy resin systems
39	8,703,845		Curable resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material
40	8,703,844		Low-viscosity epoxy resin composition with low blushing
41	8,703,010		Curing agent for epoxy resins and epoxy resin compositions
42	8,697,803		Epoxy resin composition and semiconductor device
43	8,680,180		Process for producing modified epoxy resin
44	8,673,108		Curable epoxy resin-based adhesive compositions
45	8,668,983		Epoxy resin composition for fiber reinforced composite material
46	8,658,742		Epoxy resin imbibed polymer particles
47	8,658,736		Epoxy resin composition, prepreg and fiber-reinforced composite material
48	8,658,723		Epoxy resin composition
49	8,653,160		Inclusion complex containing epoxy resin composition for semiconductor encapsulation
50	8,648,479		Epoxy resin composition for semiconductor encapsulant and semiconductor device using the same