EPOXY RESIN COMPOSITION AND USE THEREOF 

Application number（歐洲專利號(hào)）:  JP20140242415

Abstract：  To provide an epoxy resin composition capable of giving a cured product excellent in heat resistance and adhesion to a plating conductor layer, and to provide an adhesive film, a prepreg, and a multilayer printed wiring board using the resin composition.SOLUTION: The epoxy resin composition contains an epoxy resin having two or more epoxy groups per molecule on average, a glycoluril compound represented by chemical formula (I), and a curing accelerator. (Rand Rare each independently H, a lower alkyl group, or a phenyl group; Rto Rare each independently H or a C1-3 mercaptoalkyl group; and n is an integer of 0-2.)

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